For electronics manufacturing, packaging must balance protection, cleanliness, and production speed. Utien Pack’s thermoforming packaging solution for circuit boards uses flexible bottom film and top-seal function to deliver lightweight, secure, and efficient protection for high-volume shipments. Each formed pocket holds the PCB firmly, preventing vibration and contamination during storage or transport.
Dust & Static ProtectionAirtight top-seal and optional anti-static film keep circuits safe from dust and ESD damage.
High-Output EfficiencyContinuous flexible-film operation supports rapid cycles for mass production.
Material EconomyFlexible film design lowers packaging cost while maintaining consistent sealing integrity.
The RC R Series Thermoforming Packaging Machine is optimized for high-speed production using flexible bottom film. It forms precise pockets for electronic components and applies top-seal closure with strong adhesion. Servo-driven forming and sealing stations ensure accuracy, while quick-change molds support different PCB dimensions or layouts. The machine’s automated control system guarantees repeatable performance and reliability for large-scale electronics manufacturing.
Packaging method: Top Seal and Modified Atmosphere Packaging (MAP)
Equipment features: fully automatic operation, high efficiency, mold easy change system, Lightweight packaging reduces material and logistics cost.
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