Pie Thermoforming MAP Packaging Solution

Pies require stable, protective packaging to maintain freshness and prevent surface damage. Utien Pack’s MAP thermoforming solution uses rigid bottom film to form secure trays that hold each pie in place while modified atmosphere sealing extends shelf life and preserves flavor. The result is a clean, attractive pack suitable for retail and cold-chain distribution.

Three Major Advantages

Material-saving ThermoformingReduces film use while maintaining strong tray rigidity.
Quick Mold ChangeSupports different pie sizes and multi-cavity layouts.
Precision Die-cuttingProvides clean, uniform sealing edges for premium presentation.

Packaging Machine

Rigid Bottom Film Thermoforming Packaging Machine

The RC Y Series Thermoforming Packaging Machine forms deep, rigid-film cavities for pie products and applies precise MAP sealing. Its servo-driven system ensures stable forming accuracy, while optional die-cutting delivers smooth, professional edges. Designed with a hygienic frame and quick-change mold structure, the RC Y Series supports efficient, flexible dessert production.

Packaging method: Modified Atmosphere Packaging (MAP)
Equipment features: fully automatic operation, high efficiency, mold easy change system, MAP sealing preserves freshness and flavor.

COMPANY

MACHINE

Industries

Contact Us

Tel: +86 13606526028
Email: contact@utien.com
Address:255 Shuguang Road,Kebei Industrial Zone,Shaoxing,312081,China

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